IIT Madras Cooling Design has led to the development of an advanced thermal management system that helps to prevent overheating in compact electronic devices. Researchers at IIT Madras designed a novel Flat Plate Pulsating Heat Pipe (FPPHP) featuring an antiparallel configuration and an O-ring design that improves heat dissipation. Tests showed the new design reduces thermal resistance by about 16%, while aluminium versions performed nearly 20% better than comparable copper models. The innovation can enhance the performance, reliability and lifespan of consumer electronics such as laptops and smartphones, as well as electric vehicles, data centres, defence and aerospace applications. IIT Madras Cooling Design represents a significant step towards developing more efficient and compact cooling technologies for next-generation electronic systems.
IIT Madras Cooling Design: Researchers Develop New Technology to Prevent Electronics Overheating
